publications

2023

  1. MICRO
    LogNIC: A High-Level Performance Model for SmartNICs
    Zerui Guo, Jiaxin Lin, Yuebin Bai, Daehyeok Kim, Michael Swift, Aditya Akella, and Ming Liu
    In Proceedings of 56th IEEE/ACM International Symposium on Microarchitecture, October 2023
  2. SIGCOMM
    LEED: A Low-Power, Fast Persistent Key-Value Store on SmartNIC JBOFs
    Zerui Guo, Hua Zhang, Chenxingyu Zhao, Yuebin Bai, Michael Swift, and Ming Liu
    In Proceedings of the ACM SIGCOMM 2023 Conference, September 2023